Etching pcb aluminum, aluminum basis PCB manufacturer – PCB & MCPCB

What ETSA PCB Aluminum? Let’s explore the principles, applications, etc. processes, technical parameters, general problems and solutions, differences between ETSA PCB copper.

What is Aluminum PCB ETSA?

ETSA PCB Aluminum is the manufacturing process that eliminates the excess of copper foil from aluminum -based circuit boards using chemical solutions (for example, chloride acid copper), forming the desired conductive traces while maintaining structural integrity. Unlike traditional FR4 etching, aluminum substrate etc. requires strict control of temperature, pressure, and rate of ETSA to minimize side erosion (≤15%) and ensure the width of the space/accuracy of the space (≥0.2mm), especially for high power applications such as motor control boards.

The principle of aluminum pcb etc.

Chemical dissolution mechanism

• Copper solution of acid chloride selectively attacks the exposed copper foil (open area) while leaving a whole pattern trail.
• The aluminum substrate acts as a rigid base, which requires etchant compatibility to prevent substrate corrosion.

Precision control parameter

• Temperature: maintained at 50-60 ℃ (± 2 ℃ tolerance) to balance the reaction speed and side erosion.
• Pressure: 1.5-2.5kg/cm² The spray pressure ensures the contact of the uniform solution without over-agitation.

Side erosion mitigation

• The direction of the etchant flow and mask alignment minimizes the dissolution of lateral copper (≤15% of the ethsa side rate).
• It is important for trace accuracy 0.2mm+/space in high current design (for example, PCB control motor).

Specific adaptation of material

• Unlike FR4, the aluminum substrate requires a slower ETSA rate (3-5μm/minute) to avoid warping that is induced by thermal stress.
• Neutralization post-etsa prevents galvanic aluminum-copper corrosion.

Quality verification

• The width of the line/space is measured through an optic microscope (± 0.02mm tolerance).
• Analysis of the cross section confirms the integrity of the track profile (side walls 90 °).

When to use aluminum PCB etc.?

• High power electronics: Motor control, inverter, power supply (> 50a today).
• LED lighting system: LED module high crossed, automotive headlamps.
• Automotive ECU/PowerTrain: Engine control unit, battery management system.
• RF Application & High Frequency: Pangkalan 5G station amplifier, RF power module.
• Industrial Control Equipment: PLC Module, Servo Drive System.

What is the ETSA PCB aluminum process?

1. Surface preparation

• Clean the aluminum substrate using an alkaline solution to remove oil/oxide.
• Apply micro-ethies (for example, sulfuric acid) to a more rough surface for better phoresist adhesion.

2. Photoresist layer

• Dry films or liquid photoresis are applied through roller or spray coatings.
• The thickness is controlled at 20-30μm to hold ETSA without cutting.

3. Exposure & Development

• UV exposure through circuit pattern masks (for example, wavelength 365nm).
• Alkaline developers (for example, 0.8-1.2% Na2CO3) dissolve unpacked photoresis, revealing copper areas to be carved.

4. ETSA Stage

• Chloride copper acid solution (Cucl₂ + HCl) is sprayed at 50-60 ℃.
• Parameters: 1.5-2.5kg/cm² Pressure, ETSA rate 3-5μm/min.

5. Phamesist stripping

• Alkaline stripper (for example, 3-5% NaOH) eliminates the remaining photoresis at 40-50 ℃.
• Ultrasonic cleaning ensures that there is no organic residue left.

6. Post-Etsa Processing

• Acid neutralization (for example, 5% H₂So₄) to prevent corrosion of aluminum-copper galvanic.
• Dry baking (120-150 ℃) removes moisture and increases traces adhesion.

7. Quality inspection

• The optical microscope checks the width/line space (± 0.02mm tolerance).
• The cross -section analysis verified 90 ° side walls and zero undercut substrate.

ETSA Aluminum PCB Technical Parameters

General problems & solutions in the Aluminum PCB ETSA process

Excessive side etc.

Symptom: Copper trace side walls indicate the broating, deviation of the width of the line> 0.03mm.

Solution:

• Add 5-10% glycerol additive to increase vertical dissolution.
• Adjust the spray pressure to 1.8-2.2kg/cm² (reduce the impact of turbulent flow)
• Applying etching pulsating: the spray cycle 3 seconds / 0.5 seconds pause.

Aluminum surface corrosion (white spots/pitting)

Symptom: The aluminum substrate shows> ETSA holes in 0.1mm.

Solution:

• Maintain real-time pH control at 8.5 ± 0.3
• Use dual-layer liquid photoresis (5μm epoxy base layer)
• Neutralization of post-Etha citric acid (3%concentration, soaking 45s)

Damage to fine lines (＜ 0.2mm broken footprints)

Symptom: Discontinuities-Trace on high frequency circuits

Solution:

• Use an ultra-low-low 18th 18r (RTF copper RTF) profile.
• Optimize Pre-Kue: 110 ℃ × 30 minutes relieve stress.
• ETSA is slow to the precision control 2μm/min.

Uneven etching (variation of copper thickness)

Symptom: > 10% variations of copper thickness throughout the panel

Solution:

• Install the rotating rack (continuous rotation 2-3rpm).
• Optimize the layout of the nozzle with a beehive nest matrix (a distance of 50mm).
• Monitoring the thickness of beta-ray real-time (3 points per panel).

Residual copper slag (micro-serial risk)

Symptom: <50μm copper particles between traces

Solution:

• Add ultrasonic cleaning (40kHz, 60 ℃ air deionization).
• Rinse high pressure water jet (8MPA, angle of 45 °).
• Add 0.5g/l Edta Disodium Salt Chelating Agent.

The difference between aluminum pcb vs ethsa pcb copper

Why choose the best technology as an aluminum base PCB manufacturer?

The reason why choosing us as Aluminum pcb manufacturer base:

• 19 Years of Research and Development Expertise Aluminum Substrate: Specifically in the development of high -empowered aluminum PCB since 2006, with more than 500 global client projects sent in all industrial lighting, automotive electronics, and communication equipment.

• Multiple Certification Quality System: ISO 9001/IATF 16949 Double Certification, in accordance with Medical Standards (ISO 13485) and Automotive. 100% AOI inspection ensures zero tolerance for soldering bridges, misalignment, or copper residues.

• The leading ETSA precision in the industry: Utilizing the throbbing process (3 seconds / 0.5 seconds spray) with 5-10% glycerol additives, reaching the ethsa rate of ≤15% and the accuracy of the line width of ± 0.02mm, supporting the processing of ultra-Halus 0.15mm circuits.

• Thermal management innovation: The design of the heat discipline reduces the temperature of the operation of the device by 30%, paired with the aluminum substrate 3W/m · K High-Conductivity Aluminum for stable performance in a high temperature environment.

• Fast Prototype 24 Hours: Import directly Altium/Pads design files, coupled with in-house etching paths, allows 24-hour prototype delivery and 48 hours shipping, speeding up time to the market.

• Optimization of Free DFM Design: The thermal Pre-Reviews Engineering Team through the layout and trace of distance, proactively reduces ETSA defects and reduces the cost of re-workmanship by more than 40%, especially for complex multilayer design.

• Environmentally friendly & cost -effective solutions: Lead -free ETSA process and 25% recycled aluminum content meets Rohs/range standards while offering budget -friendly options for mass production, balancing performance and affordability.

Welcome to contact us if you have questions for aluminum PCB base: [email protected].

Tags: aluminum base pcb, aluminum pcb etching

This entry was posted on Friday, August 22, 2025 at 17:57 and submitted under the best PCB, BestTPCB, MCPCB, Metal Core PCB. You can follow any response to this entry through RSS 2.0 bait. You can jump to the end and leave a response. Pinging is currently not permitted.