Data Sheet, Dielectric Constant & RF Applications

PCB material RO4350B is one of the most widely used laminates for high-frequency circuit design, especially in high-speed RF, microwave…
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PCB material RO4350B is one of the most widely used laminates for high-frequency circuit design, especially in high-speed RF, microwave and digital applications. As signal frequencies continue to increase in modern electronic devices—such as 5G communications, automotive radar, and satellite systems—the limitations of standard FR4 materials become increasingly apparent. Engineers increasingly need materials that can be maintained low signal loss, stable dielectric performance and reliable thermal behavior.

What is RO4350B PCB Material?

The RO4350B PCB material is a laminate containing hydrocarbon ceramics developed by Rogers Corporation, designed specifically for high frequency applications and RF circuits.

Unlike standard FR4 material, RO4350B is designed to produce:

  • Low dielectric loss for minimal signal attenuation
  • Stable dielectric constant (Dk) over a wide frequency range
  • High thermal reliability under lead free assembly
  • FR4 compatible processingreducing manufacturing complexity

This combination allows engineers to design High-speed RF, microwave and PCB with predictable electrical performance while maintaining scalable production.

RO4350B Data Sheet Overview

Category Owned by RO4350B Typical Values Meaning of Engineering
Hot Tg (DSC/TMA) >280 °C Excellent thermal stability, lead free safe
TD (5% weight loss) ≥390°C High thermal decomposition resistance
T260 >30 minutes Strong resistance to delamination
T288 >15 minutes Resistant to high temperature reflow
KTE (X/Y) 10–12 ppm/°C Matches well with copper, minimal warping
CTE (Z axis, 32 ppm/°C Improves PTH reliability
Thermal Conductivity 0.69 W/m·K Better heat dissipation than standard FR‑4
Electricity Dielectric Constant (10 GHz) 3.48 ±0.05 Design Dk = 3.66 for impedance
Dissipation Factor (10 GHz) 0.0037 Very low signal loss
Volume Resistivity 1.2×10¹⁰ MΩ·cm High insulation stability
Surface Resistivity 4.2×10⁹ MΩ Low risk of leakage
Dielectric Strength ≥30 kV/mm Good insulation performance
Mechanical Flexural Strength ≥250 MPa Good stiffness
Peel Strength ≥1.0 N/mm Reliable copper adhesion
Young’s Modulus ~18 GPA Structural stability
Humidity & Reliability Water Absorption ≤0.06% Stable in humid environments
CAF resistance Very good Safe for dense multilayer RF boards
Flammability UL 94 V‑0 High security standards
Process Lead Free Compatible Yes Standard SMT assembly
Max Number of Layers Up to 20–30 layers Works for multilayer RF/HDI
Compatible Prepreg RO4450B Optimized multilayer bonding

Main Features of RO4350B PCB Material

1. Excellent High Frequency Electrical Performance

A stable Dk of 3.48 ±0.05 and ultra-low Df minimizes insertion loss and phase shift, supporting precise impedance control for high-speed antennas, filters and channels up to 77 GHz and beyond.

2. Outstanding Thermal Reliability

Tg >280 °C and high Td ensure stability during multiple lead-free reflows. Low CTE on the X/Y/Z axes reduces thermal stress, greatly improving via and board reliability in thermal cycling.

3. Easy Processing Like FR‑4

Unlike PTFE material, RO4350B uses standard drilling, coating and lamination. Supports mixed stacks with FR‑4, saving costs while maintaining RF performance.

4. Low Humidity & High Environmental Stability

Water absorption ≤0.06% maintains consistent electrical properties in high humidity. The V‑0 rating and strong mechanical strength suit automotive, industrial and aerospace environments.

5. Versatile Multilayer Compatibility

Paired with RO4450B prepreg for multilayer RF boards. Supports hybrid design: RO4350B for RF layer, FR‑4 for digital/power layer to balance performance and BOM cost.

What is the Dielectric Constant of RO4350B?

That Dielectric constant RO4350B is:

  • 3.48 ± 0.05 at 10GHz
  • ~3.66 for design calculations

This value remains stable from MHz to tens of GHzwhich is very important for impedance controlled RF designs.

Why This Matters

Stable dk allows:

  • Appropriate 50Ω transmission line design
  • Reliable RF matching network
  • Consistent signal timing and phase control

In contrast, FR4 materials show significant variations with frequency, leading to impedance deviations.

RO4350B PCB Material Application

  • 5G base station, antenna, microwave filter
  • Automotive radar (ADAS 24GHz / 77GHz)
  • RF power amplifier, coupler, divider
  • Satellite communications, space radar
  • Backplane and high-speed interconnects
  • WLAN, RFID, point-to-point radio
  • Test & measurement instrumentation

RO4350B vs RO4003C vs FR‑4

Owned by RO4350B RO4003C FR‑4 standard
Dk @10GHz 3.48 3.38 ~4.4
Df@10GHz 0.0037 0.0027 0.020–0.030
Tg >280 °C >280 °C 130–150 °C
Thermal Conductivity 0.69 0.64 ~0.25
FR‑4 Process Compatibility Yes Yes N/A
Fireproof V‑0 Not‑V‑0 V‑0
Max Frequency Up to 77GHz+ Up to 40GHz ~3GHz
Cost Currently Medium‑High Low
Best For General RF, 5G, automotive radar Very low loss RF Low-speed digital

How to Choose RO4350B for Your PCB Design?

Choose RO4350B if:

  • Your design involves RF, microwave, or high speed signals >3 GHz
  • you need Stable impedance and low insertion loss
  • you want Processing like FR‑4 but the performance is better
  • Applications: automotive radar, 5G, aerospace, test instruments
  • you need V‑0 flame retardant for commercial/industrial purposes

Consider alternatives if:

  • Very low loss → RO4003C
  • Pure cost priority → FR‑4 / S1000H
  • Digital low speed non‑RF → standard high‑Tg FR‑4

Frequently Asked Questions

1. What is the difference between RO4350B and FR-4?

Although both can be processed using standard fabrication methods, their electrical performance differs significantly. RO4350B is a hydrocarbon/ceramic laminate designed for high frequency applications (up to 77 GHz), offering a stable dielectric constant (Dk) and much lower signal loss (Loss Tangent of 0.0037) compared with FR-4 (Loss Tangent of ~0.015–0.025). The FR-4 typically struggles with signal integrity above 2–3 GHz, whereas the RO4350B maintains its properties in the millimeter wave range.

2. Is the RO4350B compatible with standard lead-free soldering?

Yes. RO4350B has a high glass transition temperature (Temperature > 280°C) and decomposition temperature (Yes) from 390°C. This makes it fully compatible with automated assembly and lead-free reflow soldering processes, which typically peak at around 260°C. Low Z-axis coefficient of thermal expansion (32 ppm/°C) also ensures the plated through hole (PTH) remains reliable during thermal cycling.

3. What is the Dielectric Constant (Dk) of Rogers 4350B?

The standard design Dielectric Constant for RO4350B is 3.48 ± 0.05 at 10Ghz. This value is very stable over a wide frequency range, which is very important for designing controlled impedance transmission lines and wideband matching networks.

Notes: For very thin materials (e.g. 0.004″), the Dk specification may shift slightly to 3.36.

4. How does the RO4350B compare to the RO4003C?

Both belong to the Rogers 4000 series, but the main difference is the level of fire resistance. RO4350B is UL 94 V-0 rated, making it the industry standard for commercial and active devices requiring fire safety certification. RO4003C is not rated UL 94 V-0, although it offers a slightly lower loss tangent (0.0027) and a slightly lower Dk (3.38), so it is preferred for specific passive applications where every fraction of a decibel counts.

5. Does the RO4350B require special plasma etching for through-hole coating?

Unlike PTFE-based materials (such as the Rogers 5000 or 6000 series), RO4350B is thermosetting hydrocarbons laminate. This means it can be processed using standard epoxy/glass techniques (FR-4). It is true No requires special preparations, such as sodium naphthenate or plasma etching, which significantly reduces production costs and lead times.

Get RO4350B PCB Support

If your project involves high-speed RF or PCB design, choosing the right material is critical.

We are happy to support you with:

  • Stacked design
  • RF PCB Optimization
  • Fast PCB & PCBA production

📧 [email protected]

Don’t hesitate to contact us — your project will be supported by engineers who understand real RF challenges.

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This entry was posted on Saturday, April 18, 2026 at 10:01 am and is filed under PCB Materials. You can follow any responses to this entry via the RSS 2.0 feed. You can skip to the end and leave a response. Ping is currently not allowed.

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